Poster Presentation at ICT 2024

At ICT 2024, organized by FH Öberösterreich and the German Society for Non-Destructive Testing (DGZfP) in Wels, Austria,

Martin Gurka and Benedikt Boos will present their poster entitled:

Characterization of the interface between SMA wire and polymer matrix using synchrotron in situ pull-out measurements

Further information on the event can be found at https://www.fh-ooe.at/ict2024/.